| Autor: |
Juan Boon Tan, Kwang Sing Yew, Ramasamy Chockalingam, Yi Wanbing, Kemao Lin, Yi Jiang, Jonathan Yoong Seang Ong, Weining Cheng, Hsieh Curtis Chun-I, Soh Yun Siah |
| Rok vydání: |
2020 |
| Předmět: |
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| Zdroj: |
2020 IEEE International Interconnect Technology Conference (IITC). |
| DOI: |
10.1109/iitc47697.2020.9515630 |
| Popis: |
Two phenomena of dual damascene via open in extremely low local metal pattern density region, and when connected through a narrow width metal line to a big pad opening with high density sea of vias are identified. A systematic study was carried out to investigate the impact of extreme pattern density design on dual damascene via integrity. Local metal density, interconnects metal line width, length, and pad size connecting to an isolated via are investigated to establish the correlation to via open and to explain the failure mechanism. Finally design for manufacturing solution is proposed, apart from process fix as the total solution. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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