WCMP Endpoint Application for the Dishing Erosion Improvement

Autor:	Ying Xu, Runtao Zhao, Zhipeng Huang, Changxing Tan, Zhize Zhu, Weifeng Zhang
Rok vydání:	2012
Předmět:	Erosion Environmental science Geotechnical engineering
Zdroj:	ECS Transactions. 44:609-612
ISSN:	1938-6737 1938-5862
DOI:	10.1149/1.3694376
Popis:	In the semiconductor manufacturing industry, W CMP has been widely used in both in FEOL and BEOL. However, in the advanced technology (≤65nm), WCMP is used primarily in FEOL. For FEOL WCMP process, dishing erosion performance is very critical. If the dishing erosion performance is not good, the downstream Cu CMP process will be impacted resulting in copper residue and potential yield loss
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::464ad36d5edb3756813df81defaa81f7 https://doi.org/10.1149/1.3694376 Zobrazit plný text záznamu