High bond reliability of newly developed silver alloy bonding wire
| Autor: | Motoki Eto, Teruo Haibara, Noritoshi Araki, Uno Tomohiro, Ohkabe Takumi, Oyamada Tetsuya, Yamada Takashi |
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| Rok vydání: | 2019 |
| Předmět: |
010302 applied physics
Wire bonding Materials science Bond 020208 electrical & electronic engineering Alloy 02 engineering and technology engineering.material 01 natural sciences Automotive electronics Reliability (semiconductor) 0103 physical sciences Automotive Engineering 0202 electrical engineering electronic engineering information engineering engineering Composite material |
| Zdroj: | International Symposium on Microelectronics. 2019:000524-000529 |
| ISSN: | 2380-4505 |
| Popis: | In this paper, a new type of silver (Ag) alloy bonding wire is introduced, and its bonding property and long term reliability are demonstrated. The new Ag wire, called GX2s, is developed as a cost-effective alternative to gold (Au) wire targeting at automotive electronics. The wire material is doped with added element, and its electrical resistivity is much lower than the conventional palladium (Pd) doped Ag wire. Highly accelerated stress test (HAST) and high temperature storage life (HTSL) test were carried out along with other bonding evaluations. The results show that GX2s has good bonding property and excellent long term bond reliability. Microstructural analyses of bond interface after the reliability tests were also conducted to investigate its improving mechanism. GX2s is a suitable alternative to Au wire for many applications including high temperature automotive devices. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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