| Autor: |
Andrzej Moscicki, Tomasz Falat, Przemyslaw Matkowski, Krzysztof Stojek, Bartosz Platek, Jan Felba |
| Rok vydání: |
2014 |
| Předmět: |
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| Zdroj: |
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC). |
| Popis: |
Materials based on sintered silver nanoparticles seems to be an effective thermal interface materials for microelectronic packaging, especially in power electronics where the thermal management is a key problem of reliability. The main advantages of such materials is high thermal conductivity of silver, ease of application in integrated circuit production and relatively low temperature of sintering which is comparable with curing temperature of epoxy adhesives. Sintering process depends on such factor as time, temperature and pressure. Within this paper two different materials based on silver nanoparticles was tested and the influence of sintering process on the mechanical strength of joints was analyzed. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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