Influence of Low Oxygen Content on the Recrystallization Behavior of Rolled Copper Foil
| Autor: | Li Rongping, Hongliang Zhao, Xianglei Dong, Wenbo Chen, Mingwei Wu |
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| Rok vydání: | 2018 |
| Předmět: |
Materials science
Annealing (metallurgy) Metallurgy Metals and Alloys chemistry.chemical_element Recrystallization (metallurgy) 02 engineering and technology Plasticity 010402 general chemistry 021001 nanoscience & nanotechnology 01 natural sciences Oxygen Copper 0104 chemical sciences Inorganic Chemistry Particle aggregation chemistry Materials Chemistry Grain boundary 0210 nano-technology FOIL method |
| Zdroj: | Oxidation of Metals. 90:203-215 |
| ISSN: | 1573-4889 0030-770X |
| DOI: | 10.1007/s11085-018-9834-9 |
| Popis: | In this paper, the influence of low oxygen content on the recrystallization of rolled copper foil was studied at different annealing temperatures. The results showed that the recrystallization temperature decreases with an increase in the oxygen content in the foil. Significant transition points occur when the oxygen content exceeds 30 ppm. The oxygen simultaneously affects particle aggregation on the grain boundaries and the dislocation mobility during deformation processes, modulating the recrystallization. A higher oxygen content enables a lower value of the recrystallization temperature, which can in turn effectively enhance plasticity to improve the forming property of the copper foil. It is expected that our investigations on the recrystallization of copper foil can provide a mechanism-based interpretation and technical support for the production optimization and application of copper-based materials. |
| Databáze: | OpenAIRE |
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