| Popis: |
Advanced packaging is required to have higher performance, smaller size, and lower energy consumption, thus a widely variety of materials have been used and the writing layer becomes denser. In this background, it is expected that it would be necessary to control the surface shape and state of a widely variety of materials. In this paper, Descum process, the control of surface roughness and surface modification of various material are shown by plasma treatment. In Descum process, it is shown that oxidation and corrosion of Cu layer can be suppressed by optimization the plasma treatment. In redistribution layer (RDL) production, the required surface shape is different depending on the purpose of each process. By changing the process gas to N2, the surface roughness is significantly increased, this phenomenon is effective to improve the adhesion strength between insulation layers. Furthermore, the plasma treatment has already used as a pre-plating treatment. In order to prevent the occurrence of plating defects, the surface of various materials is made hydrophilic. In future, the plasma technology will be attracting attention with the complexity and miniaturization of advanced packaging product. |
