Laser Integration on Silicon through Flip-chip Bonding with Efficient Coupling

Autor:	Ting Ta Chi, Nanxi Li, Hong Cai, Zhenyu Li, Landobasa Y M Tobing, Haitao Yu, Lennon Y. T. Lee, Wen Lee
Rok vydání:	2022
Zdroj:	2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
DOI:	10.1109/eptc56328.2022.10013178
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::306ea9065cefe50e306412955171fdf4 https://doi.org/10.1109/eptc56328.2022.10013178 Zobrazit plný text záznamu