Ripening-assisted void formation in the matrix of lead-free solder joints during solid-state aging

Autor:	Jong-Kai Lin, King-Ning Tu, T.Y. Lee, D.R. Frear, Jin-Wook Jang
Rok vydání:	2007
Předmět:	Void (astronomy) Materials science Kirkendall effect Mechanical Engineering Diffusion Intermetallic Condensed Matter Physics Stress (mechanics) Mechanics of Materials Soldering General Materials Science Composite material Volume contraction Joint (geology)
Zdroj:	Journal of Materials Research. 22:826-830
ISSN:	2044-5326 0884-2914
DOI:	10.1557/jmr.2007.0131
Popis:	Void formation in lead-free solder joints, away from the joint interface, has been observed after solid-state aging. These voids are attached to intermetallic precipitates in the solder matrix, especially to those that are adjacent to the layered intermetallic at the joint interface. Two potential void formation mechanisms are discussed. The mechanism proposed to describe void formation is that a flux of vacancies is created due to volume contraction during solid-state reaction. The ripening process among the intermetallics also assists this process. Using the suggested mechanisms, the void size was estimated. This phenomenon differs from the classical Kirkendall void formation because it is a nonequilibrium state of void formation and stress generation.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::2fe8d88e7ac8da238a853880805fd2af https://doi.org/10.1557/jmr.2007.0131 Zobrazit plný text záznamu Full text from SpringerLink