Shear Strength and Interfacial Compound of Sn-Ag-Bi-In Alloy

Autor:	Joon-Kwon Moon, Jae Pil Jung, Moon-Il Kim
Rok vydání:	2002
Předmět:	Materials science Mechanical Engineering Alloy Metallurgy Rosin Solderability engineering.material Condensed Matter Physics Microstructure Mechanics of Materials Soldering Melting point engineering Shear strength medicine General Materials Science Composite material Joint (geology) medicine.drug
Zdroj:	MATERIALS TRANSACTIONS. 43:1791-1796
ISSN:	1347-5320 1345-9678
DOI:	10.2320/matertrans.43.1791
Popis:	Sn–3Ag–8Bi–5In solder (melting point, 461–477 K) was investigated as a lead(Pb)-free solder. In order to evaluate the solderability of the Sn–Ag–Bi–In alloy, the shear strength of soldered joint and inter-metallic compound (IMC) were investigated. As an experimental procedure, a 0.5 mm diameter solder was set on the Ni/Cu/Cr-pad of a Si-substrate. The solder ball on the pad was reflowed with Rosin Mildly Activated (RMA)-flux in air, and the reflow temperature was controlled between 483 K and 533 K. The shear strength and microstructure of the solder ball were evaluated with and without aging. The results show that the shear strength of the Sn–3Ag–8Bi–5In solder ball had the highest value of 1.69N by reflowing at 513 K for 10 s. The shear strength decreased from 1.69N to 0.95N as the IMC thickness was increased from 1.75 \\micron to 1.9 \\micron. Needle-shaped Ni3Sn4 and plate-like (Ni, Cu)3Sn4 formed on the interface between the solder and the Under Bump Metallization (UBM) that was bonded for 10 s at 513 K.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::2df11bbad6a08eeb341bb06b58876a90 https://doi.org/10.2320/matertrans.43.1791 Zobrazit plný text záznamu