Ultra-thin silicon-on-sapphire for flip-chip based CMOS/optoelectronic device integration

Autor:	M. Wong, J. Cable, Tri Q. Le, Ronald E. Reedy, M. P. Divakar, R. Weiss, M. Pendleton, M. Englekirk, Charles B. Kuznia, Donald J. Albares, S. Thai
Rok vydání:	2002
Předmět:	Multi-mode optical fiber Optical fiber Materials science Silicon business.industry Silicon on insulator chemistry.chemical_element law.invention CMOS Silicon on sapphire chemistry law Sapphire Optoelectronics business Flip chip
Zdroj:	LEOS 2001. 14th Annual Meeting of the IEEE Lasers and Electro-Optics Society (Cat. No.01CH37242).
Popis:	We describe flip chip bonding of arrayed VCSELs and PIN detectors onto ultra-thin silicon-on-sapphire (UTSi). We present results of UTSi optical transmitters and receivers for 3.125 Gbps multimode parallel optical fiber links at 850 nm.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::2cc2cce591b880bdf5b68e4e0856b7c1 https://doi.org/10.1109/leos.2001.969062 Zobrazit plný text záznamu