Thermal stability of silicon-containing methacrylate-based bilayer resist for 193-nm lithography

Autor: Daniela White, Bernard T. Beauchemin, Thomas Steinhaeusler, Andrew J. Blakeney
Rok vydání: 1998
Předmět:
Zdroj: SPIE Proceedings.
ISSN: 0277-786X
DOI: 10.1117/12.312383
Popis: Thermal decomposition of silyl substituted methacrylate terpolymers containing acid sensitive groups was studied using thermogravimetric analysis. The onset of decomposition was found to be a function of the microenvironment, i.e. the molar % composition of the acid sensitive group monomer. The Flynn and Wall method ofestimating E a was used to estimate the E a for decomposition of the terpolymer and where possible, for the acid sensitive group.
Databáze: OpenAIRE