| Autor: |
Chau-Jie Zhan, Yu-Min Lin, Ren-Shin Cheng, Jing-Ye Juang, Chia-Wen Fan, Su-Yu Fun, Tao-Chih Chang, Su-Ching Chung, Shi-Yi Huang, Yu-Wei Huang |
| Rok vydání: |
2015 |
| Předmět: |
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| Zdroj: |
2015 IEEE 65th Electronic Components and Technology Conference (ECTC). |
| DOI: |
10.1109/ectc.2015.7159636 |
| Popis: |
In 3D integration, die stacking together with underfilling by capillary-type underfill are the principal processes within whole conventional assembly process. How to integrate and shorten the total process steps during assembly and increase the die-stacking yield especially for thin die stack to improve the throughput that can meet the requirement from industry will be a crucial issue. In this investigation, we proposed the high throughput adhesive bonding scheme by using wafer-level underfill material for the die-to-interposer stacking with 30µm-pitch micro interconnections. The reliability characterization of the die-to-interposer stack by such bonding scheme was implemented and confirmed. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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