| Autor: |
Ravinder Pal Singh, Zishan Ali Syed Mohammed, Lulu Peng, Chor Shu Cheng, Don Disney, Salahuddin Raju, Chui King Jien, Lawrence Selvaraj, Serine Soh |
| Rok vydání: |
2019 |
| Předmět: |
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| Zdroj: |
2019 Electron Devices Technology and Manufacturing Conference (EDTM). |
| DOI: |
10.1109/edtm.2019.8731263 |
| Popis: |
In this paper, novel on-chip inductors with thick copper and thick magnetic core are designed and fabricated. With improved magnetic core lamination and thicker Cu layers, these inductors have achieved a high Q factor of 21.1 at 20MHz, as well as a high L/R dc of 420nH/ohm, which is the best-known reported Q factor and L/R dc for on-chip inductors of large inductances (>100nH). |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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