Development of Highly Thermal Conductive Adhesive Film for High Performance Power Modules

Autor:	Hiroshi Takasugi, Shin Teraki, Issei Aoki, Jyunya Sato, Fumikazu Komatsu
Rok vydání:	2016
Předmět:	Materials science Thermal conductivity Thermal bridge Thermal insulation business.industry Power module Adhesive Conductivity Composite material business Electrical conductor Curing (chemistry)
Zdroj:	2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
DOI:	10.1109/ectc.2016.47
Popis:	Obtained high thermal conductivity and insulation performance on an adhesive film comprising strongly agglomerated hexagonal boron nitride filler by press curing it with high pressure.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::1fed9eaa3ea16fb173248b2a64c9559a https://doi.org/10.1109/ectc.2016.47 Zobrazit plný text záznamu