Package structure of polarized white chip-on-board light-emitting diode with high thermal conductivity
| Autor: | Jung-Chieh Su, Sheng-Bo Huang |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
010302 applied physics
Materials science Extinction ratio business.industry Thermal resistance Phosphor 02 engineering and technology Polarizer 021001 nanoscience & nanotechnology 01 natural sciences Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials law.invention Thermal conductivity law 0103 physical sciences Optoelectronics Electrical and Electronic Engineering 0210 nano-technology business Luminous efficacy Diode Light-emitting diode |
| Zdroj: | Optics & Laser Technology. 126:106065 |
| ISSN: | 0030-3992 |
| DOI: | 10.1016/j.optlastec.2020.106065 |
| Popis: | The package structure of high power white chip-on-board (COB) light-emitting diode (LED) is investigated. The temperature-dependent performance of the white COB LED combined with a polymeric wire-grid polarizer film (WGF) is optimized. The optimized packaging structure is with a modified phosphor resin layer encapsulated to blue COB LED and an optically transparent plate deposited on the modified phosphor resin layer. The modified phosphor resin comprises a mixture of yellow phosphor and AlN resin for reducing thermal resistance. Results show that the extinction ratio is 83 and the luminous efficacy is 61.4 lm/W at an input power of 8 W for the polarized white COB LED. Without the WGF, the luminous efficacy of the package structure of the COB LED is 90 lm/W. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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