Joint properties enhancement for PbTe thermoelectric materials by addition of diffusion barrier
| Autor: | Albert T. Wu, Chun Hsien Wang, Tian-Wey Lan, Hsien Chien Hsieh, Tse Hsiao Lee, Yang-Yuan Chen, Hsu Shen Chu |
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| Rok vydání: | 2020 |
| Předmět: |
Materials science
Diffusion barrier Intermetallic 02 engineering and technology 010402 general chemistry 021001 nanoscience & nanotechnology Condensed Matter Physics Thermoelectric materials 01 natural sciences 0104 chemical sciences Barrier layer Mechanical joint Thermoelectric effect Electrode General Materials Science Composite material 0210 nano-technology Layer (electronics) |
| Zdroj: | Materials Chemistry and Physics. 246:122848 |
| ISSN: | 0254-0584 |
| DOI: | 10.1016/j.matchemphys.2020.122848 |
| Popis: | PbTe-based alloys are potential mid-temperature thermoelectric materials due to their excellent thermoelectric properties. Formation of intermetallic deteriorates mechanical joint strength and thermoelectric performance as well. In the present work, interfacial reaction, electrical and mechanical behaviors for both p- and n-PbTe joints with an addition of diffusion barrier layer are investigated. The results show that Co–P is a suitable barrier layer for PbTe-based thermoelectric devices with Cu or Ni electrode to inhibit the growth of massive intermetallic compound formation caused by fast interdiffusion in Cu/p-PbTe joints and melting of the joints in Cu/n-PbTe joints. Directly bonded Ni electrode induced formation of needle-like IMCs and disintegration of the electrodes in p- and n-PbTe modules respectively. Severe interfacial problems were overcome by adding a Co–P diffusion barrier, mechanical strength was improved. In addition, the Co–P layers enhanced the thermoelectric properties of the joints. The addition of the barrier layer increased 27% and 109% of the zT for p- and n-type joints, respectively. |
| Databáze: | OpenAIRE |
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