Microstructure and Properties of Ternary Cu-Ti-Sn Alloy

Autor: Xiaohong Yang, Xian-hui Wang, Ting-ting Guo, Chunyu Chen, Jun-tao Zou
Rok vydání: 2015
Předmět:
Zdroj: Journal of Materials Engineering and Performance. 24:2738-2743
ISSN: 1544-1024
1059-9495
DOI: 10.1007/s11665-015-1483-4
Popis: The effect of Sn addition and heat treatment on the microstructure and properties of Cu-3Ti and Cu-2Ti alloys was studied. The microstructure and phase constituents were characterized by an optical microscope, x-ray diffractometer, and transmission electron microscope, and the electrical conductivity and hardness were determined as well. The results show that the as-cast microstructure of Cu-Ti-Sn alloys consists of α-Cu(Ti,Sn) and primary CuSn3Ti5 intermetallic compound. CuSn3Ti5 phase has a hexagonal structure with the lattice parameters a = 0.81737 nm, b = 0.81737 nm, and c = 0.55773 nm. With the increase of aging time, the electrical conductivity progressively increases, while the hardness increases and then decreases. After aging at 450 °C for 8 h, Cu-3Ti-2Sn alloy has an electrical conductivity of 23.1 MS/m and a hardness of 134.5 HV, and the electrical conductivity and hardness of Cu-2Ti-2Sn alloy are 21.5 MS/m and 119.3 HV, respectively. An appropriate aging is beneficial for the precipitation of coherent metastable β′-Cu4Ti phase, which can strengthen Cu-3Ti-2Sn and Cu-2Ti-2Sn alloys. However, a prolonged aging time results in the decrease of hardness due to the formation of incoherent equilibrium β-Cu3Ti phase. The presence of CuSn3Ti5 phase reduces the solute Ti content in the copper matrix and, thus, gives rise to the increase of the electrical conductivity of Cu-Ti-Sn alloys.
Databáze: OpenAIRE
Externí odkaz: