Application and Advantage of CMP in Silicon Wafer Reclaim

Autor:	Shiwei Xiong, Ying Xu, Weifeng Zhang, Shan Wang, Runtao Zhao, Xucheng Wang, Changxing Tan
Rok vydání:	2010
Předmět:	Materials science business.industry Optoelectronics Wafer business
Zdroj:	ECS Transactions. 27:539-544
ISSN:	1938-6737 1938-5862
DOI:	10.1149/1.3360671
Popis:	In this paper, a silicon CMP process has been developed inside semiconductor fabrication to reclaim bare silicon wafers for cost and time reductions. Firstly, the high level defect after CMP was encountered and mainly particle; after related polishing and cleaning processes were optimized, the defect count was much reduced but still higher than the specification; finally, the defect count was dramatically decreased and met the specification by adding a surfactant (TMAH) in polishing. The effect of surfactant on defect reduction is also discussed in this paper.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::1eaa89726730e00f552ba585f717b071 https://doi.org/10.1149/1.3360671 Zobrazit plný text záznamu