| Autor: |
Ser Choong Chong, V. N. Sekhar, Ling Xie, Daniel Ismael Cereno, Hongyu Li |
| Rok vydání: |
2017 |
| Předmět: |
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| Zdroj: |
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). |
| DOI: |
10.1109/eptc.2017.8277433 |
| Popis: |
Non-Conductive Film (NCF) is an attractive option for tacking the chip on the wafer before sending the tacked sample to gang bonder to form the solder interconnects. Chip on Wafer (CoW) bonding is a preferred choice over wafer to wafer bonding as it ensures electrical tested good dies to be used in the process. CoW bonding is also a preferred choice over chip on chip (CoC) as it offers higher throughput as compared to CoC process. The solder interconnects had been formed using temporary tacking in flip chip bonder and final solder interconnect formation in gang bonder with NCF. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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