Mechanical and fluidic characterization of microfluidic interconnects for lab-on-a-chip applications

Autor:	S.M. Westwood, Derek G. Sahota, Bonnie L. Gray, Seema Jaffer
Rok vydání:	2008
Předmět:	Engineering Interconnection business.industry Microfluidics Lab-on-a-chip Characterization (materials science) law.invention Reliability (semiconductor) Interference (communication) law Hardware_INTEGRATEDCIRCUITS Electronic engineering Figure of merit Fluidics business
Zdroj:	2008 IEEE 14th International Mixed-Signals, Sensors, and Systems Test Workshop.
DOI:	10.1109/ims3tw.2008.4581624
Popis:	In this paper, we present mechanical and fluidic testing apparatus and protocols that we have developed for characterizing both chip-to-chip and world-to-chip interconnects. We address the design, calibration, and limits of our testing apparatus. We also present standardized figures of merit that we have developed for comparing our interconnect structures and techniques. Finally, we address reliability issues when multiple interconnects between chips are involved.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::1cc577fcece1f62a2086f21318e4d751 https://doi.org/10.1109/ims3tw.2008.4581624 Zobrazit plný text záznamu