| Autor: |
Jin-Hyuk Gang, Jin-Won Joo, Bong-Hee Lee, Joo-Ho Choi |
| Rok vydání: |
2010 |
| Předmět: |
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| Zdroj: |
Transactions of the Korean Society of Mechanical Engineers A. 34:1377-1384 |
| ISSN: |
1226-4873 |
| Popis: |
The objective of this study is to determine the best material model that represents the deformation behavior of the Sn37Pb solder alloy accurately. First, a specimen is fabricated and subjected to a thermal cycle with temperatures ranging from the room temperature to . An experiment is conducted to examine deformation by Moire interferometry. Three different constitutive equation models are used in the finite element analysis (FEA) of the thermal cycle. In order to minimize the difference between the FEA results and the experimental results, the material parameters of the solder alloy are considered to be unknown and are determined by conducting optimization. As a result of the study, the Anand model is found to represent the deformation behavior of the solder most accurately. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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