| Popis: |
Recent advancements in the electronics industry led to smaller and more powerful systems. Therefore, efficient heat dissipation for cooling of microelectronics systems, integrated circuit chips, power semiconductor devices such as IGBTs and laser diodes is required. In such systems, heat fluxes in the order of MW/m2 need to be removed from small spaces, while maintaining the temperature below a certain design limit (Karayiannis and Mahmoud in Appl Therm Eng 115:1372–1397, 2017 [1]). Flow boiling in microchannels is one of the most promising methods for achieving these high cooling demands because it can dissipate large heat fluxes over a small surface area by utilizing the latent heat of the coolant (Wang in Appl Therm Eng 110:369–381, 2017 [2]). Literature review indicates that there are still disagreements on the prevailing flow patterns, heat transfer rates, and pressure drop trends; see Mahmoud and Karayiannis (Encyclopedia of Two-Phase Heat Transfer and Flow IV, 2018, pp 233–301 [3]). The main objective of the present work was to investigate the flow boiling flow patterns, heat transfer coefficient, and pressure drop characteristics in a square metallic microchannel at different inlet subcooling, mass flux and heat flux conditions, using water as the working fluid. |
