Optoelectronic Glass Substrates for Co-packaging of Optics and ASICs
| Autor: | S. Ekin Kocabas, Jason R. Grenier, Alan F. Evans, Chad C. Terwilliger, Lars Brusberg, Aramais R. Zakharian |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
Optical fiber
Silicon photonics Materials science business.industry ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION 02 engineering and technology Substrate (electronics) Chip 01 natural sciences GeneralLiterature_MISCELLANEOUS law.invention 010309 optics 020210 optoelectronics & photonics Optics Application-specific integrated circuit law 0103 physical sciences Hardware_INTEGRATEDCIRCUITS 0202 electrical engineering electronic engineering information engineering Optoelectronics Fiber business |
| Zdroj: | OFC |
| Popis: | A glass packaging substrate with integrated waveguides and evanescent couplers for silicon photonic chiplets is introduced for fiber to chip interconnects with high-channel counts required for co-packaging of optics and switch ASICs in next-generation datacenters. |
| Databáze: | OpenAIRE |
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