Electroless Ru/Cu Deposition Without Pd Activation for the Formation of Continuous Cu Seed Layers in High-Aspect-Ratio Via-Holes

Autor:	Bongyoung Yoo, Sungho Seo
Rok vydání:	2016
Předmět:	Materials science 020209 energy Metallurgy 0202 electrical engineering electronic engineering information engineering Biomedical Engineering General Materials Science Bioengineering Cu deposition 02 engineering and technology General Chemistry Condensed Matter Physics
Zdroj:	Journal of Nanoscience and Nanotechnology. 16:11267-11271
ISSN:	1533-4880
DOI:	10.1166/jnn.2016.13491
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::158d7efc72d3bb5eef93bff5b0f4b1f4 https://doi.org/10.1166/jnn.2016.13491 Zobrazit plný text záznamu