Thickness and microstructure influence on the nanocrystalline Cu thin films’ mechanical properties
| Autor: | Simón Roa, Martin Sirena |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
010302 applied physics
Materials science Annealing (metallurgy) Mechanical Engineering 02 engineering and technology Nanoindentation 021001 nanoscience & nanotechnology Condensed Matter Physics Microstructure 01 natural sciences Indentation hardness Nanocrystalline material Mechanics of Materials Sputtering 0103 physical sciences General Materials Science sense organs Composite material Thin film 0210 nano-technology Elastic modulus |
| Zdroj: | Journal of Materials Research. 36:938-948 |
| ISSN: | 2044-5326 0884-2914 |
| Popis: | We report a systematic study about the thickness and microstructure influence on the mechanical properties of nanocrystalline Cu thin films grown by DC sputtering. Mechanical properties were determined by using atomic force microscopy-assisted nanoindentation. Results showed a clear decrease of the elastic modulus and indentation hardness as the film thickness and grain size increase. Annealing time as well as the temperature seem to affect the mechanical behavior of the films by inducing microstructural changes, producing comparable changes to those produced by size effects (film thickness). Results suggest that both effects are important to explain the mechanical behavior of polycrystalline thin films. This work helps understanding what physical mechanisms play a fundamental role on the mechanical behavior of thin films. |
| Databáze: | OpenAIRE |
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