Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder

Autor:	S. F. Muhd Amli, M. A. A. Mohd Salleh, M. I. I. Ramli, M. S. Abdul Aziz, H. Yasuda, J. Chaiprapa, K. Nogita
Rok vydání:	2022
Předmět:	Electrical and Electronic Engineering Condensed Matter Physics Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials
Zdroj:	Journal of Materials Science: Materials in Electronics. 33:14249-14263
ISSN:	1573-482X 0957-4522
DOI:	10.1007/s10854-022-08353-z
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::13535d7aeb2467a781c28b180b3e78d8 https://doi.org/10.1007/s10854-022-08353-z Zobrazit plný text záznamu Full text from SpringerLink