Foamed Elastomers For Packaging Interconnections, Testing And Burn‐In Applications
Autor: | Paul A. Lauro, Yun-Hsin Liao, Keith E. Fogel, D.-Y. Shih, Jr. James Lupton Hedrick |
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Rok vydání: | 1996 |
Předmět: | |
Zdroj: | MRS Proceedings. 445 |
ISSN: | 1946-4274 0272-9172 |
Popis: | The present study is directed to a new foamed elastomer composition for supporting the interconnecting conductive wires in the Elasticon™ interposer connector for the packaging interconnections, test and burn‐in applications. The compressibility of interposer connector can be tailored by introducing controlled volume fraction of foam into elastomer or filled elastomer. The foamed elastomer has been successful applied to a new Ball Grid Array (BGA) module testing socket to meet the contact force requirement. |
Databáze: | OpenAIRE |
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