Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies
| Autor: | Paul D. Franzon, Eun Chu Oh, W.R. Davis, A.M. Sule |
|---|---|
| Rok vydání: | 2009 |
| Předmět: |
business.industry
Computer science Circuit design Fast Fourier transform Parallel computing Integrated circuit Integrated circuit design Content-addressable memory law.invention Reduction (complexity) Hardware and Architecture law Electrical and Electronic Engineering business Software Computer hardware Energy (signal processing) |
| Zdroj: | IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 17:496-506 |
| ISSN: | 1063-8210 |
| DOI: | 10.1109/tvlsi.2008.2009352 |
| Popis: | 3-D stacking and integration can provide system advantages. This paper explores application drivers and computer-aided design (CAD) for 3-D integrated circuits (ICs). Interconnect-rich applications especially benefit, sometimes up to the equivalent of two technology nodes. This paper presents physical-design case studies of ternary content-addressable memories (TCAMs), first-in first-out (FIFO) memories, and a 8192-point fast Fourier transform (FFT) processor in order to quantify the benefit of the through-silicon vias in an available 180-nm 3-D process. The TCAM shows a 23% power reduction and the FFT shows a 22% reduction in cycle-time, coupled with an 18% reduction in energy per transform. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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