Kinetics of sulfide ion adsorption at copper amalgam electrode

Autor:	Anna Basa, Tadeusz Krogulec, Andrzej S. Baranski
Rok vydání:	1999
Předmět:	chemistry.chemical_classification Sulfide General Chemical Engineering Activated complex Inorganic chemistry chemistry.chemical_element Copper Analytical Chemistry Mercury (element) Adsorption Reaction rate constant chemistry Desorption Electrochemistry Voltammetry
Zdroj:	Journal of Electroanalytical Chemistry. 463:200-211
ISSN:	1572-6657
DOI:	10.1016/s0022-0728(98)00455-0
Popis:	Convolutive voltammetry was employed in studies of the kinetics of sulfide ion adsorption at copper amalgam and mercury electrodes. Measurements were carried out for low electrode coverages to minimize the effect of the lateral interaction energy, and the results were extrapolated to zero coverage. In the case of a Cu amalgam electrode (7.4×10−4 mol dm−3 of Cu) kinetic and thermodynamic parameters of the adsorption/desorption process were determined in solutions of different pH (3.6 to 12.8). For pH
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::0b97ce23b766a727faeb1799d334e981 https://doi.org/10.1016/s0022-0728(98)00455-0 Zobrazit plný text záznamu Full Text from ScienceDirect