Heterogeneous Chip Integration into Silicon Templates by Through-Wafer Copper Electroplating

Autor:	Christopher D. Meyer, Sarah S. Bedair, Scott M. Trocchia, Manrico A. Mirabelli, William L. Benard, Tony G. Ivanov
Rok vydání:	2012
Zdroj:	ECS Meeting Abstracts. :874-874
ISSN:	2151-2043
DOI:	10.1149/ma2012-01/20/874
Popis:	not Available.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::0af64d28f1732981abfc7899fbefac26 https://doi.org/10.1149/ma2012-01/20/874 Zobrazit plný text záznamu