Periodic patterning of silicon by direct nanosecond laser interference ablation
| Autor: | Txaber Tavera, Santiago M. Olaizola, Ainara Rodríguez, Enrique Castaño, Noemí Pérez, P. Yurrita |
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| Rok vydání: | 2011 |
| Předmět: |
Materials science
Fabrication Laser ablation Silicon Hybrid silicon laser business.industry General Physics and Astronomy chemistry.chemical_element Surfaces and Interfaces General Chemistry Condensed Matter Physics Laser Fluence Surfaces Coatings and Films law.invention Optics chemistry Interference (communication) law Optoelectronics Wafer business |
| Zdroj: | Applied Surface Science. 258:1175-1180 |
| ISSN: | 0169-4332 |
| DOI: | 10.1016/j.apsusc.2011.09.062 |
| Popis: | The production of periodic structures in silicon wafers by four-beam is presented. Because laser interference ablation is a single-step and cost-effective process, there is a great technological interest in the fabrication of these structures for their use as antireflection surfaces. Three different laser fluences are used to modify the silicon surface (0.8 J cm−2, 1.3 J cm−2, 2.0 J cm−2) creating bumps in the rim of the irradiated area. Laser induced periodic surface structures (LIPSS), in particular micro and nano-ripples, are also observed. Measurements of the reflectivity show a decrease in the reflectance for the samples processed with a laser fluence of 2.0 J cm−2, probably caused by the appearance of the nano-ripples in the structured area, while bumps start to deteriorate. |
| Databáze: | OpenAIRE |
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