Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator
| Autor: | N.C. Tien, J.-L.A. Yeh, Hongrui Jiang |
|---|---|
| Rok vydání: | 1999 |
| Předmět: |
Integrated design
Bulk micromachining Fabrication Materials science Silicon business.industry Mechanical Engineering chemistry.chemical_element Surface micromachining chemistry Electronic engineering Deep reactive-ion etching Optoelectronics Electrical and Electronic Engineering Reactive-ion etching business Actuator |
| Zdroj: | Journal of Microelectromechanical Systems. 8:456-465 |
| ISSN: | 1057-7157 |
| DOI: | 10.1109/84.809061 |
| Popis: | This paper presents a fabrication process that integrates polysilicon surface micromachining and deep reactive ion etching (DRIE) bulk silicon micromachining. The process takes advantage of the design flexibility of polysilicon surface micromachining and the deep silicon structures possible with DRIE. As a demonstration, a torsional actuator driven by a combdrive moving in the out-of-plane direction, consisting of polysilicon fingers and bulk silicon fingers, has been fabricated. The integrated process allows the combdrive to be integrated with any structure made by polysilicon surface micromachining. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|