| Autor: |
FENG Chenyue, HUANG Hui, MA Yan |
| Jazyk: |
angličtina |
| Rok vydání: |
2021 |
| Předmět: |
|
| Zdroj: |
Journal of Shanghai Normal University (Natural Sciences), Vol 50, Iss 4, Pp 408-412 (2021) |
| ISSN: |
1000-5137 |
| Popis: |
The ball grid array(BGA)packaging chip had to be detectedby X-ray image because of its internal pin package process characteristics. An automatic quality detection method of chip welding based on X-ray image for printed circuit board (PCB)was presented in this paper, which determined the chip area by the method of projection transformation. According to the characteristics of the spherical solder joints, the pin solder joints were recognized automatically by Hough transform. The proposed method could fully realize the detection of welding quality automatically and improve the efficiency and accuracy of the solder joints detection. Besides, the efficiency and reliability of the industrial production could also be improved. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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