Effect of the temperature on the strain distribution induced in SOI photonic substrate by copper filled TSVs, using advanced scanning X-ray nano- diffraction

Autor:	Vianne, B., Escoubas, S., Richard, M.I., Fiori, V., Farcy, A., Thomas, O.
Přispěvatelé:	Institut des Matériaux, de Microélectronique et des Nanosciences de Provence (IM2NP), Aix Marseille Université (AMU)-Université de Toulon (UTLN)-Centre National de la Recherche Scientifique (CNRS), Université de Toulon (UTLN)-Centre National de la Recherche Scientifique (CNRS)-Aix Marseille Université (AMU), Bibliométrie, IM2NP
Jazyk:	angličtina
Rok vydání:	2016
Předmět:	[SPI.NANO] Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics ComputingMilieux_MISCELLANEOUS
Zdroj:	14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics–Experiment and Simulation 14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics–Experiment and Simulation, May 2016, Dresden, Germany
Popis:	International audience
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::66b5c93749dde6c5a98614298490214f https://hal-amu.archives-ouvertes.fr/hal-01454838 Zobrazit plný text záznamu