| Abstrakt: |
The impact of incorporating emulsified solutions of three novel termiticides based on bifenthrin, chlorfenapyr, and 5 – amino – 1 - [2,6 – dichloro – 4 - (trifluoromethyl) phenyl] – 4 - [(1R,S) - (trifluoromethyl) sulfinyl] - 1H – pyrazol – 3 - carbonitrile (ATTC) during the manufacture of waferboard on its internal bond (IB) strength, modulus of rupture (MOR) and modulus of elasticity (MOE) is evaluated and compared to control lab-made boards and commercial waferboards containing no biocide and a commercial waferboard containing 1% zinc borate (ZnB).The termiticides were compatible with the PF-resins typical of those used for waferboard and oriented strand boards (OSB) with no effect on IB strength, MOR or MOE up to concentrations of 0.0074, 0.0100, and 0.0074 wt.% for the bifenthrin and chlorfenapyr and ATTC termiticides, respectively. The bifenthrin and chlorfenapyr based termiticides were also found to be compatible with a pMDI-resin typically of that used in OSB at concentrations of 0.0052 wt % and 0.0073 wt %. However, the IB results for the waferboard containing 0.052 wt % ATTC were 36% lower than the control boards. Based on these results it was concluded that the bifenthrin and chlorfenapyr termiticides are suitable for in-line use with PF-and pMDI - resins, whereas the ATTC termiticide is only suitable for the PF - resins. |
