Machine vision system for alignment in die-to-wafer bonder
| Autor: | Sasián, José, Youngworth, Richard N., Chu, Jiyoung, Seo, Minhwan, Kim, Hyungjin, Joo, Wondon, Ahn, Sungmin, Bae, Sangwoo |
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| Zdroj: | Proceedings of SPIE; October 2022, Vol. 12222 Issue: 1 p122220L-122220L-6, 1099987p |
| Databáze: | Supplemental Index |
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