Robust HfxSi1-xO2 Gate Dielectric using Co-injection Atomic Layer Deposition

Autor: Bartholomew, Larry, Bavin, Andy, Lazerand, Thierry, Rao, Vivek
Zdroj: ECS Transactions; March 2009, Vol. 18 Issue: 1 p617-623, 7p
Abstrakt: Using a novel Atomic Layer Deposition (ALD) process in which multiple chemical precursors are simultaneously injected to form a monolayer on the substrate and then oxidized, we demonstrate a robust hafnium silicate film that can be easily tuned to meet specific device requirements. A large process window is demonstrated via physical and electrical performance of the film. The film has been fully integrated into a CMOS structure and repeatable parametric results over a wide range of film compositions are shown.
Databáze: Supplemental Index