| Autor: |
Taushanoff, Stefanie, Dubin, Val M, Wallace, Andrea, Mantooth, Alan |
| Zdroj: |
ECS Transactions; June 2018, Vol. 85 Issue: 13 p803-814, 12p |
| Abstrakt: |
NANO3D Systems has developed an electrochemical technique for direct copper plating on alumina & LTCC substrates and selective plating of screen-printed Ag & Ag/Pd features. When applied directly to the alumina substrate, electrodeposited copper outperformed the DBC substrates in thermal shock tests. When copper plated on thick screen patterned features, it reduces the line resistance and would not inevitably cause the features to delaminate under thermal stress. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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