Fabrication of high aspect ratio bumps for focal plane arrays applications

Autor: Andresen, Bjørn F., Fulop, Gabor F., Hanson, Charles M., Zhang, Wei, Bereznycky, Paul, Morales, Manuel, Huang, Wei, Malchow, Doug, Liobe, John, Endicter, Scott, Caro, Michael, Evans, Michael J., Houlihan, Sean
Zdroj: Proceedings of SPIE; May 2019, Vol. 11002 Issue: 1 p110022F-110022F-10, 10892189p
Databáze: Supplemental Index