| Autor: |
Ooi, Eang Pang, Daud, Ruslizam, Amin, N.A.M., Hong, T.W., Abdul Majid, M.S., Afendi, M., Mohamad, Azizul, Ariffin, Ahmad Kamal |
| Zdroj: |
Applied Mechanics and Materials; August 2015, Vol. 786 Issue: 1 p136-140, 5p |
| Abstrakt: |
Solder joints are exposed to drop impact, vibration loading, bending, and twisting of PCBs. Study on this matter will lead to prediction of fracture load, prevalent fracture mode, exact joint interconnect size and life of joints under brittle and fatigue failure. This paper presents a finite element modeling of intermetallic compounds solder joints failure based on displacement extrapolation method. Based on conceptual FE model of intermetallic IMC solder joints, this paper present the full model of IMC model for intermetallic Mode I and Mode II fracture prediction. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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