Wafer level warpage characterization for backside manufacturing processes of TSV interposers.
| Autor: | Jiang, Feng, Wang, Qibin, Xue, Kai, Jing, Xiangmeng, Yu, Daquan, Shangguan, Dongkai |
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| Zdroj: | 2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p1740-1744, 5p |
| Databáze: | Complementary Index |
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