High vacuum wafer level packaging for high-value MEMS applications.
| Autor: | Nicolas, S., Greco, F., Caplet, S., Coutier, C., Dressler, C., Audoin, M., Baillin, X., Dehag, G., Souchon, F., Fanget, S. |
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| Zdroj: | 2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p1714-1721, 8p |
| Databáze: | Complementary Index |
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