Advanced metal and dielectric barrier cap films for Cu low k interconnects.
| Autor: | Priyadarshini, Deepika, Nguyen, S., Shobha, H., Cohen, S., Shaw, T., Liniger, E., Hu, C.K., Parks, C., Adams, E., Burnham, J., Simon, A.H., Bonilla, G., Grill, A., Canaperi, D., Edelstein, D., Collins, D., Balseanu, M., Stolfi, M., Ren, J., Shah, K. |
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| Zdroj: | IEEE International Interconnect Technology Conference; 2014, p185-188, 4p |
| Databáze: | Complementary Index |
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