3D-enabled heterogeneous integrated circuits.
| Autor: | Chen, C.K., Yost, D.R.W., Aull, B.F., Chen, C.L., Gouker, P.M., Knecht, J.M., Tyrrell, B.M., Warner, K., Wheeler, B., Wyatt, P.W., Keast, C.L., Suntharalingam, V. |
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| Zdroj: | 2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S); 2013, p1-29, 29p |
| Databáze: | Complementary Index |
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