Low-cost multichip modules.
| Autor: | Dobers, M., Seyffert, M., Hauschild, F.D., Czaya, C.-P. |
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| Zdroj: | IEEE Transactions on Components, Packaging & Manufacturing Technology, Part A; 1995, Vol. 18 Issue 3, p462-465, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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