Dry etch challenges of 0.25 /spl mu/m dual damascene structures.
| Autor: | Schnabel, R.F., Dobuzinski, D., Wang, F., Perng, D.C., Gambino, J., Palm, H. |
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| Zdroj: | European Workshop Materials for Advanced Metallization,; 1998, p102-104, 3p |
| Databáze: | Complementary Index |
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