Challenges of aluminum RIE technology at sub 0.45 /spl mu/m pitches [DRAM interconnects].
| Autor: | Ravikumar, R., Filippi, R.G., Iggulden, R.C., Kiewra, E.W., Kirihata, T., Kitahara, H., Lee, G.Y., Liegl, B., Matsunaga, T., Ning, X.J., Rath, D.L., Stojakovic, G., Weber, S.J. |
|---|---|
| Zdroj: | Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat No99EX247); 1999, p203-205, 3p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|