Diffusion and oxide viscous flow mechanism in SDB process and silicon wafer rapid thermal bonding.
| Autor: | Tong, Q.-Y., Xu, X.-L., Shen, H. |
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| Zdroj: | Electronics Letters (Institution of Engineering & Technology); 05/24/1990, Vol. 26 Issue 11, p697-699, 3p |
| Databáze: | Complementary Index |
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