Dilute Cu Alloying for Sn-Cu Bumping by Annealing Electroplated Cu/Sn Stacks on Ti/Ni/Pd UBM.
| Autor: | Ezawa, H., Higuchi, K., Seto, M., Uchida, M., Togasaki, T. |
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| Zdroj: | 2006 1st Electronic Systemintegration Technology Conference; 2006, p550-555, 6p |
| Databáze: | Complementary Index |
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