An overview of stress free polishing of Cu with ultra low-k(k<2.0) films.
| Autor: | Pallinti, J., Lakshminarayanan, S., Barth, W., Wright, P., Lu, M., Reder, S., Kwak, L., Catabay, W., Wang, D., Ho, F. |
|---|---|
| Zdroj: | Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695); 2003, p83-85, 3p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|